Industry Directory | Manufacturer
Vigneshwara Enterprises, An Outstanding Screen Printing And Printer In Chennai, Labels And Sticker Manufacturer And Supplier In Chennai.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
Used SMT Equipment | Pick and Place/Feeders
FUJI sFAB-a (alpha) odd-form inserter Surface mount technology continues to grow as the most popular method for assembling electronic parts, and the quantity of discrete parts used has reduced year by year. However, discrete parts do continue to
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
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. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
GPD Global | https://www.gpd-global.com/fluiddispense-prod-ncm5000.php
. An uneven surface does not impact the process. Process rates up to 50,000 DPH can be achieved. Jetting on uneven surface. Easy Setup & Cleaning Consisting of only 3 primary parts, the NCM5000 jetting pump has a main body, a flexible diaphragm with ball, and a nozzle plate, all of which are easy to install, disassemble, and clean
