Horizontal Laminar Airflow Benches allows operation in a sterile and particle free conditions. Because of the continuous flushing of the working area by a unidirectional and ultra filtered airflow, it assures a full product protection. Cabinets are
Semi-autoamtic pcb board printer/circuit board printing machine 1.Adopt the brand-new high-speed guide rail and frequency conversion motor actuates, guarantees the printing precision. 2.Scraper seat can be adjusted front and rear, to chose the appro
Electronics Forum | Fri Nov 11 13:52:05 EST 2011 | SheanDalton
What is the size of the low standoff components you find trace wash effluent? and, what is the gap from the board to the underside of the component? If your component has a very low standoff, and/or, a wide footprint, you may want to consider findi
Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon
GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C
Used SMT Equipment | In-Circuit Testers
Agilent N2620A FrameScope Pro N2620A FrameScope Pro Handheld Gigabit Ethernet Network Performance Analyzer The FrameScope Pro is Agilent's handheld 10/100/1000 Mbit/s Ethernet deployment and troubleshooting tool. With the FrameScope Pro, tech
Used SMT Equipment | In-Circuit Testers
Agilent N2620A FrameScope ProN2620A FrameScope Pro Handheld Gigabit Ethernet Network Performance Analyzer The FrameScope Pro is Agilent's handheld 10/100/1000 Mbit/s Ethernet deployment and troubleshooting tool. With the FrameScope Pro, technicians d
Industry News | 2021-12-17 16:23:47.0
Good-Ark Semi's MOSFET with ESD Protection from New Yorker Electronics provides Low Gate Charge and High Repetitive Avalanche Rating
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Parts & Supplies | SMT Equipment
Unidirectional / roll blade Name: MPM presses roll bar unidirectional blade wiping mechanism Part Number: roll blade Description: MPM wiping mechanism presses roll bar unidirectional blade, blade roll Applicable models: UP; AP Printing
Parts & Supplies | SMT Equipment
Unidirectional / roll blade Name: MPM presses roll bar unidirectional blade wiping mechanism Part Number: roll blade Description: MPM wiping mechanism presses roll bar unidirectional blade, blade roll Applicable models: UP; AP Printing
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
PLG series Computer Control Resonant High Frequency Fatigue Testing Machine Application： Electromagnetic resonance High-frequency fatigue testing machine has simple structure, convenient operation, high efficiency, low energy consumption and othe
| https://www.smtfactory.com/strengthening-a-decade-long-partnership-smt-engineer-training-at-our-factory.html
. The knowledge transfer was not only unidirectional but served as a platform for mutual learning and growth, further solidifying the foundation of our enduring partnership
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOwareGEMInterface_1.2.0.pdf
) Conditional Selector Rounded boxes represent states. A state transition is shown graphically with a line from the old state terminating with the arrow symbol at the new state. Transitions are unidirectional -- while the reverse http://www.semi.org/ GPD Global
