New SMT Equipment: unsoldered lga pads (1)

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Electronics Forum: unsoldered lga pads (134)

unsoldered joints

Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia

need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic

Re: unsoldered joints

Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory

Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun

Industry News: unsoldered lga pads (27)

SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Industry News | 2009-04-23 20:54:01.0

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Surface Mount Technology Association (SMTA)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Industry News | 2016-09-22 17:27:09.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: unsoldered lga pads (1)

Panasonic  BELT 030AC181821

Panasonic BELT 030AC181821

Parts & Supplies | SMT Equipment

We also supply following Panasonic Spare parts : KXFB02GBC06 FRAME KXFB05CGA01 BOLT N210009258AA PLATE KXFB02GJA00 BLOCK KXFB02GKA00 BLOCK N210018293AA COVER N210018294AA COVER N210018299AA COVER KXFB02NSA00 BRACKET KXFB02NVA00 DOG KXFB02

Qinyi Electronics Co.,Ltd

Technical Library: unsoldered lga pads (2)

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

Reliability Study of Bottom Terminated Components

Technical Library | 2015-07-14 13:19:10.0

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.

Flex (Flextronics International)

Videos: unsoldered lga pads (1)

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

Training Courses: unsoldered lga pads (3)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Express Newsletter: unsoldered lga pads (236)


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