Electronics Forum | Wed Jul 17 10:22:15 EDT 2013 | rgduval
Sure. Section 7.4 covers unsupported holes, and defines the usual standards. Clinching, fillet on the plated side, lead protrusion, etc. Cheers, ..rob
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
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SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
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. Non-Stick Surface Activation - The Nordson MARCH plasma process can modify fluoropolymer surfaces and desmear resins to prepare hole walls for electro-less copper or direct metalization
