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DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Wed Feb 02 01:20:30 EST 2005 | sg2004
Anyone can let me know what is the difference between UP3000 and UP3030 in features? And, if possible, let me know all standard features of UP3030. I couldn't find any standard spec on the web. Thanks.
Electronics Forum | Fri Mar 12 13:20:05 EST 2021 | vasu278
I need know how to connect ups+,ups-,1+,1- cables to ups
Used SMT Equipment | Screen Printers
Make: MPM Model: UP2000/B Features: OS: Windows NT Software: 7.2F Screen Printer Location: Camarillo, CA USA
Industry News | 2013-01-04 16:00:38.0
04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.
Parts & Supplies | General Purpose Equipment
We are a shop in Chicago has had this machine on site for several years. It is an older lamp-based cutting system and will be calibrated and tuned up prior to sale to winning bidder. We are in the process of upgrading our capabilities and this machi
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2018-04-27 13:23:31.0
When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Sun Jul 11 00:00:00 EDT 2021 - Sat Jul 31 00:00:00 EDT 2021 | Nashua, New Hampshire USA
Feeder Frenzy's Shark Week 2021 Sales Event
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Portland, Maine USA | Sales/Marketing
Beau Tech, a manufacturer of hand tools for the electronics industry and hobby market is seeking a Sales Representative in Europe. Responsibilities include: Set up distributors in the European market. Promote product line through trade shows, etc.
Career Center | Bronx, New York USA | Production,Technical Support
90% of my working experiences, are related with SMT environment: I been dealing with a lot different situation for the last 16 + years. I'm a handyman person as well. know to handle power and precision, etc. For the last year and a half I been in cha
Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production
• Excellent Analytical, inter-personal and communication skills • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti
GPD Global | https://www.gpd-global.com/co_website/features-addons-max.php
Contacts Technical Support About Company Profile News Events Awards Employment » System Models » MAX » Dispenser Add-On Options Multi-Functional Add-On Options Barcode Reader / UV Curing Wand / Two Part Mixing / Pick and Place / UPS
Lewis & Clark | http://www.lewis-clark.com/product-tag/genesis/
(30 per Head) 3 Spindle Series (2) PEC Cameras – 1 per beam (2) WFOV Cameras – 1 per beam (2) NFOV Cameras – 1 per beam 4 x 70 Nozzle Changer Single Line Dual Board Stop UPS Version