Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
Electronics Forum | Wed Jan 23 06:12:36 EST 2019 | tirthkar8980
Dear Team, Need help, we are trying to make urea core solder wire but the problem is some time core remains partially empty no urea filling in solder wire. please help me how to solve this problem. thank you, Tirthkar
Electronics Forum | Wed Mar 17 21:42:19 EST 1999 | Chuck Garth
We are presently aluminum wirebonding to gold plated lands. Our board manufacturer has been very inconsistient in the quality. It seems as though theey are over etched by about half the amount they should be. Can anyone give me the spec's that normal
Used SMT Equipment | SMD Placement Machines
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Used SMT Equipment | Chipshooters / Chip Mounters
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
Industry News | 2003-05-08 07:27:27.0
Easby Electronics is offering a line of low-cost plug and socket PCB terminal blocks in a vast range of styles and sizes, which now include 3.50 and 3.81mm pitches.
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Parts & Supplies | Pick and Place/Feeders
NXT second generation hexagon nut N1085A Fuji placement machine NXT second generation applicable accessories Hexagonal nut N1085A complete accessories manufacturers sell Model: FUJI Mounter Specifications: NXT second generation machine hexagon nu
Technical Library | 2017-09-25 10:36:52.0
Laser wire stripping was developed by NASA in the 1970s as part of the Space Shuttle program. The technology made it possible to use smaller sized wires with thinner insulations, without risk of the damage that can be caused by traditional mechanical wire stripping methods. Laser wire stripping technology was commercialized in the 1990s and was initially used for aerospace and defense applications. Laser wire stripping then grew significantly when the consumer electronics market exploded as lasers became the only stripping solution for the tiny data cables found in laptops, mobile phones and other consumer electronics products. Another large industry that has adopted laser wire stripping methods, and for good reason, is high-end medical device manufacturing.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Wed Feb 19 00:00:00 EST 2020 | Las Vegas, Nevada USA
IPC & WHMA Wire Harness Manufacturing Conference
Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Fri Sep 28 00:00:00 EDT 2018 | Lyon, France
IPC/WHMA Cable and Wire Harness Assemblies Conference
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Portsmouth, New Hampshire USA | Production
Assembly: * Must be mechanically or electrically inclined * Perform a wide variety of assembly / erecting operations and procedures, i.e. bearing fits, drilling / tapping, hydraulic / lube/pneumatic. * Must be able to read blueprints or schematics
Career Center | , New Jersey USA | Engineering,Management,Production,Research and Development
A highly experienced Engineering/Manufacturing Manager with 40 years of experience in electronic/mechanical design and manufacturing. Recent years, specializing in electronic manufacturing with emphasis on Surface Mount Technology. Currently employed
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
| https://www.eptac.com/faqs/ask-helena-leo/ask/to-from-wire-labeling-specifications-and-requirements
To - From Wire Labeling Specifications and Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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