Industry Directory | Manufacturer
RENICE SSDs line vary on form factor, interface, MLC or SLC NAND, industrial temperature and with or without Secure erase/ Power-failure protection, AES Encryption, Write-protect function.Your best partner on storage devices.
New Equipment | Test Equipment
ENGMATEC offers a range of test plugs for in-circuit and functional tests of standard industrial interfaces. The test plugs are designed to speed the production testing of electronic equipment incorporating a range of standard interfaces including
The SLT-TP05-USB TouchScreen Controller provides the optimistic performance of 4-Wire Analog Resistive touch panels. It communicates with PC directly through USB port. The TouchKit Controller comes complete with 20-inch (controller to touch panel) e
Electronics Forum | Sun Mar 17 06:16:44 EDT 2013 | christian01976
Hello! You need an upgrade on AMS3.0 to use it with Windows 7. And then you need a dongle for every PC you want to use it on. And with that step ypu dont need a floppy anymore you can register the machines with usb stick or over network. Christian
Electronics Forum | Wed Jul 18 14:35:56 EDT 2012 | kruzer
I can not send or receive proper of the machine, also i cant send or recive program. on the second computer I have, "ESMT 1.0.1," there without any problem computer communicates with the machine, but this is an old program and wants to have everythin
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight W1314A-200-010-040-055-060-325-635-758-300 RF Reciever The Agilent-JDSU W1314A RF receiver is an integral part of the Agilent drive-test system. With easy configuration and robust connections, you can get quick and accurate mea
Used SMT Equipment | In-Circuit Testers
Tektronix MDO4104-3 Mixed Domain Oscilloscope; 3 GHz RF input Mixed Domain Oscilloscope MDO4104-3 : Mixed Domain Oscilloscope with (4) 1 GHz analog channels, (16) digital channels, and (1) 3 GHz RF input MDO4104-6 : Mixed Domain Oscillosc
Industry News | 2018-11-29 16:33:25.0
USB 3.0 SuperSpeed Isolator eliminates ground loops and ground potential differences and is ideal for measurement, industrial, automotive and audio technology applications.
Industry News | 2012-11-26 14:09:09.0
Macrotron Systems announces availability of its MacroVault OEM/ODM USB 3.0 flash drive solutions.
Parts & Supplies | Screen Printers
DEK Wiping mechanism magnet spring-G0332 (FLEXO) MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP ASSY 191088 DEK SOLVENT 183668 DEK SOLENOID VALVE 165431 DEK SINGLE BOARD
Parts & Supplies | Screen Printers
DEK plywood cylinder (158921) Description: DEK plywood cylinder CYLINDER ^ PNEUMATIC ^ COMPACT ^ 12X10 Part NO.: 158921 MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of
PCB DEPANELING MACHINE ML-CS817/ML-CS818/ML-CS818A/ML-CS818L PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc
SMTnet Express, May 20, 2021, Subscribers: 27,111, Companies: 11,359, Users: 26,657 Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration of USB-C chargers and hubs in automotive
SMTnet Express, May 5, 2022, Subscribers: 25,613, Companies: 11,567, Users: 27,202 Electronics Manufacturing Technical Articles Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration
Whizz Systems | https://www.whizzsystems.com/custom-ip-development-and-fpga-design-services/
projects involving the following protocols and standards: MPEG2/H.264 10G Ethernet/XAUI/SPI4.2 PCI Express USB 3.0 DDR2/DDR3 Memory ARM and PPC processor embedded systems Embedded SOC buses such as AMBA, AXI Encryption/Security Get In Touch Dan Williams
GPD Global | https://www.gpd-global.com/co_website/literature-dispensers.php
USB Backup Utilities 1.0 User Interface 1.0 Import / Export Data Reference Guide 22100024R 2.9.3P System Software version 2.9.3R2 FLOware Software Guide 22100080D