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Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Thu Dec 16 11:06:02 EST 1999 | Chuck Morehouse
Have any of you ever gone from using Nitrogen in your Reflow and Wave solder process to using only compressed air? No Clean users only please. I'd like to get away from Nitrogen if it makes sense.
Electronics Forum | Mon Aug 14 15:00:46 EDT 2017 | charliedci
We run a "no clean" soldering process, class II primarily, conformal coating using a Humiseal acrylic coating, applied by machine and by brush. We have seen very few coating issues in my 10+ years from contamination by body oils. We are not using glo
Used SMT Equipment | Soldering - Reflow
This equipment has been barely used and is in "Like New" condition.
Used SMT Equipment | Chipshooters / Chip Mounters
2000 Fuji CP643 SMT Pick & Place - LOW HOURS OF USE - Approx. Dimensions: 138" x 73" x 80" Item Location: Westerville, OH USA Serial: 2040 Features: CP6 43 Loading System
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Assembly Accessories
DEK CBA40 Camera Used More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Pick and Place/Feeders
Siemens 3*8mm Silver SMT FEEDER Specs: Standard: SL/KL 3*8mm 0402/0201 Brand: SIEMENS Introduce: All the following SIEMENS Feeders can be supplied. Description Spec. Part Numbre Remark Siemens Feeder 2x8mm FEEDER 141096 Original New or Used
Technical Library | 2023-01-17 17:29:40.0
A Practical Investigation into the Use of No Lead Solders for SMT Reflow
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Nano-copper sintering in formic acid vapor.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Events Calendar | Tue May 12 00:00:00 EDT 2020 - Thu May 14 00:00:00 EDT 2020 | Baltimore, Maryland USA
IPC High Reliability Forum
Events Calendar | Fri Jan 13 00:00:00 EST 2023 - Fri Jan 13 00:00:00 EST 2023 | Richardson, Texas USA
Dallas Chapter Technical Luncheon: 3D Printing of Tooling and Fixturing for the Manufacture of Electronics
Career Center | new york, Kentucky USA | Purchasing
We want somebody in smt industry outside china to work with us!the candinate should offer information of the used pick and place machines,and check,confirm and ship the equipments to HongKong, Please contact us if you are interested! David
Career Center | Phoenix, Arizona USA | Quality Control
Growing contract electronic manufacturer looking for quailified inspectors. We specialize in printed circuit board and box-build/cable assemblies. We operate a very fast-paced, dynamic business where we cater to quick-turn work. We need experience
Career Center | Valencia, California | Clerical,Production,Quality Control
Perform as General warehouse functions, pick / pack & scanning of products using ring scanner, safely use of box cutters, forklift, verbal communication skills with my lead, and co-workers, Data Entry using WAMS, In Process, Warehouse Services. Able
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
This cell contains DSP_TRAILER.CFM. This is a layout/formatting test. Eventually, useful content will fill this area.
Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
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Terms of Use - Whizz Systems Skip to content Terms of Use Services + ENGINEERING SERVICES + FPGA DESIGN SERVICES FPGA DESIGN FEATURES FPGA DEVELOPMENT
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