Industry Directory | Manufacturer
Manufacturer of UV cure coatings and adhesives for the electronics and microelectronics industries. Materials include new 100% solids "B" staged UV cure epoxy adhesives for sealing microelectronic packages.
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty
| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a
Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon
| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave
Used SMT Equipment | Pick and Place/Feeders
(2) Universal Advantis Pick and Place Systems Universal Advantis Placement System; Product Code: 4982B; AC-72; FlexJet 9 Head; Universal Advantis Placement System; Lightening Head; Product Code: 4983A; With Assorted Nozzles in Nest Auction Ite
Industry News | 2008-05-06 13:32:45.0
The future, from a lighting prospective, will look drastically different. Besides providing high flexibility and accuracy, LED technology is cost effective and saves both companies and homeowners money on electricity bills. Because of this, LED technology is being used in more and more applications throughout the world.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
https://www.ascen.ltd/Products/conformal_coating_equipment//579.html PCB conformal coating machine selective coating process for PCBA, PCB coating machine protective coating,to protect the sensitive components: from external environmental factors,vib
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Recommendations for Installing Flash LEDs on Flex Circuits Recommendations for Installing Flash LEDs on Flex Circuits For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
bonding die attach conductive epoxy die attach cure process die attach defects die attach delamination die attach epoxy die attach equipment die attach film die attach glue die attach in semiconductor
Lewis & Clark | http://www.lewis-clark.com/product-category/oven/
://www.dropbox.com/sh/scp6z10te7oz2y5/AABHK-SL7J8lQv8VrFsvRxRfa?dl=0 Asymtek UV6-18 UV Cure Oven Make: Asymtek Model: UV6-18 Details: Nordson CoolWave Curing System (2) Bulbs 12” Cure Width 230V – 50/60 Hz Location & Shipping
