Tape & Reel, Lead Inspection, Lead Repair, Moisture Bake. Vacuum Seal, Qa Inspection services for the IC Manufactures, Contract Manufactures and Distributer. Based in the Heart Silicon Valley.
Industry Directory | Manufacturer
Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.
New Equipment | Rework & Repair Equipment
Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station
New Equipment | Board Handling - Storage
Eureka TUS-2001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-2001 Capacity: 1314 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or less. Ext
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Electronics Forum | Thu Jul 18 12:05:19 EDT 2002 | yngwie
Experts, Today I received PCB in a punctured vacuum seal bag. the Humidity indicator change the colour to pink at 60%RH mark. The brd finish is Entek. Earlier our intention to get the board vacuum seal is because we want to ensure that the is no fr
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize
| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/TRCCircuits/tabid/1902/Default.aspx
: Light Duty Storage Shelving, Shipping Desk, Two-Door Cabinet, Desk, Chairs Category: 11 Marsh HT Hand Taper & Food Saver Vacuum Sealing Machine Sold at TRC Circuits on 11/30/2022 Vadnais Heights MN Previous Item Next Item Lot Number: 11 Description
Heller Industries Inc. | https://hellerindustries.com/delamination/
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
