Manufacturer of moisture and static protective packaging and related supplies.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Sep 30 15:27:26 EDT 1998 | Matthew Park
Very simple, you just buy a commerical-grade vacuum sealer. It's not that expensive. A small tabletop unit cost $2000 - $4000. I don't have a number handy. E-mail me off-line if you require more info. Regards Matthew NII, Norsat Internationa
Used SMT Equipment | Screen Printers
Very nice MPM UP2000 Stencil Printer For Sale. Machine is ready and run!! See attached pictures and information below. Equipment Description •MPM UP2000 Stencil Printer •Type: In-Line Fully Automatic •Model Number: UP2000/B •Serial Number: 22566
Used SMT Equipment | Screen Printers
DEK 265 GSX Stencil Printer Model Number: GSX Green Camera Under Stencil Cleaner Assist with Vacuum 2D Board Inspection Machine is in Very Good Condition and includes support pins, accessories, and manuals.
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Parts & Supplies | Component Packaging
Samsung SM471/481 vacuum filter VYF44M-50M Any need,please ask me. Thanks zoey@jinchensmt.com
Parts & Supplies | Component Packaging
A large number of supply samsung original accessories and high recovery Low supply samsung SMT machine filters of various sizes, filter cotton, vacuum spiral pipe, tank chain, conveyor belt, cord, thimble
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Factory price automatic bare board loaders vacuum pcb loader for smt line APPLICATION The Bare Board Loader is used for automatically loading unpopulated boards at the beginning, or in the middle of a PCB assembly line. The bare boards are l
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Diego, California USA | Sales/Marketing,Technical Support
Do you want to put your dent in the universe? Are you are tired of being part of a slow moving bureaucratic coatings organization that sells old technology, can’t get things done and seems to create processes to hinder the selling process? Are y
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
Lewis & Clark | https://www.lewis-clark.com/product/conveyor-package/
Conveyor Package - Panasonic and Nutek - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart
KingFei SMT Tech | http://www.smtspare-parts.com/buy-smc_vacuum_valve-page2.html
Buy smc vacuum valve, Good quality smc vacuum valve manufacturer Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
