Manufacturer of moisture and static protective packaging and related supplies.
New Equipment | Tape and Reel Equipment
Full-automatic taping machine 1. This equipment is a vibrating plate feeding, equipped with automatic feeding silo. 2. Optional CCD visual inspection system can be used to identify defects and directions on each surface of the material by using mu
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
Electronics Forum | Fri May 19 08:05:23 EDT 2000 | David
We do a lot of prototype work, builds occur days or months apart and moisture Absorption in IC's is a worry. I would like to bake, chuck in some silica gel and then seal or vac seal in an envelope. Does anyone have any experience of vacuum sealing wa
Electronics Forum | Tue May 23 21:03:18 EDT 2000 | Dave F
David: Beyond the information on sealing components in the archives, look for information on protecting boards. Further, consider a dessicant cabinet, as an alternative. Sources are also in the archives. Good luck. Dave F
Used SMT Equipment | Pick and Place/Feeders
Weight (KG) 3500 Video outgoing-inspection Provided Machinery Test Report Provided Core Components PLC, Engine, Bearing, Gearbox, Motor, Pressure vessel, Gear, Pump Place of Origin Japan Warranty 6 Months Condition Used Br
Used SMT Equipment | Pick and Place/Feeders
Weight (KG) 3400 Video outgoing-inspection Provided Machinery Test Report Provided Marketing Type Ordinary Product Warranty of core components 3 months Core Components PLC, Engine, Motor Place of Origin Japan Warranty 3 mo
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Parts & Supplies | Assembly Accessories
Supply Sanyo tcm3000 applicator filter cotton (filter): Product Name: filter Brand: Sanyo Model: tcm3000 Place of origin: Taiwan Shape: flakes Features: strong air permeability Package: 100pcs / package SANYO X200/X210 FILTER SANYOT
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Parts & Supplies | Component Packaging
NPM Vacuum Filter N510059928AA SMC Filter Elements for Panasonic Assembly machine Part Name: Vacuum Filter Model: N510059928AA N510059866AA N510054846AA Usage: NPM Machine Part Number: N510059928AA Package: 100pcs/bag Weight: 0.1g
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Factory price automatic bare board loaders vacuum pcb loader for smt line APPLICATION The Bare Board Loader is used for automatically loading unpopulated boards at the beginning, or in the middle of a PCB assembly line. The bare boards are l
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Diego, California USA | Sales/Marketing,Technical Support
Do you want to put your dent in the universe? Are you are tired of being part of a slow moving bureaucratic coatings organization that sells old technology, can’t get things done and seems to create processes to hinder the selling process? Are y
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
Heller Industries Inc. | https://hellerindustries.com/semiconductor-advance-packaging/
Semiconductor Advance Packaging - Heller Home » Semiconductor Advance Packaging Semiconductor Advanced Packaging Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill
KingFei SMT Tech | http://www.smtspare-parts.com/sale-12026867-durable-panasonic-vacuum-pump-kxf0dt5aa00-for-cm602-machine.html
Durable Panasonic Vacuum Pump KXF0DT5AA00 For CM602 Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
