Industry Directory | Consultant / Service Provider
InsulFab is the leader in PCB Tooling with 2 locations and unmatched engineering support we will provide the custom solution
Industry Directory | Manufacturer
JINSUNG ELECTRONICS CO. designs and manufactures the customized Printed Circuit Board(PCB) based in South Korea since 1995 throughout types of Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
The FKN Systek S100 is an economical PCB singulating saw for moderate production volumes and laboratory use. The diamond saw blade with the linear bearing positioning table to guide the PCB to be cut, allows for quick and clean singulation of PCB
Electronics Forum | Wed Jan 30 08:27:37 EST 2019 | mst3000
Hi there. We are facing an issue with the placing head of our SMT machine SIEMENS SIPLACE CF 2004 model where the vacuum reading is low (820 instead of 900). This is resulting in that the components are either falling off when the head moves onto the
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Industry News | 2016-02-15 09:53:57.0
Count On Tools has added a new product – the Precision Plate – to its award-winning line of StripFeeder systems. The StripFeeder Precision Plate allows customers to run high capacity lanes of micro components, such as 0201s, 01005s and 03015s in 4mm or 8mm tape (paper or emboss), on a single plate.
Industry News | 2014-03-25 09:35:06.0
Count On Tools Inc. (COT)announces the release of the new support plates for its line of ezLOAD Board Supports.
Parts & Supplies | SMT Equipment
Yamaha YG100 Vacuum plate Part number : KHL-M4592-00 More Yamaha parts in stock KG7-M9166-00X Yamaha Air cylinder KGA-M928B-00X YAMAHA Sensor KH4-M9166-00X YAMAHA Air cylinder KHY-M7153-00X YAMAHA Solenoid valve JA10AA-21W KM1-M7162-10X YAM
Parts & Supplies | SMT Equipment
Yamaha YG100 Vacuum plate KHL-M4592-00 More Yamaha SMT parts in stocks KG3-M7190-00X Yamaha Needle Connector 12YM KGT-M7106-00X Yamaha YG200 Shaft Nozzle Holder KHN-M7720-A1X Yamaha YS12 302A Nozzle KHN-M7790-A1X Yamaha YS12 309# Nozzle KHY-M
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
03006765-01 Kabel:Versorgung BE-Tisch ext. 03006767-03 Linear-motor Y-axis 03006775-02 Piping DLM2 HF-/X-Sseries 03006778-01 Piping TwinHead HF-/X-series 03006781S02 Portalsystem cpl.HF 03006796-01 BALLAST RESISTOR WITH PLATE 03006808-01 CABLE
Career Center | Los Angeles, Dallas, Atlanta, Texas, Georgia USA | Sales/Marketing
Client company seeks sales managers (3 Locations)who will develop a sustainable and profitable level of revenue growth for an exciting organization who has the ability to completely control the supply chain for its clients in the electronic OEM marke
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
Heller Industries Inc. | https://hellerindustries.com/parts/472073/
472073 - DOOR SEAL PLATE - (vacuum chamber oven) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.feedersupplier.com/sale-21048869-samsung-hanwha-j91741085-smt-machine-parts-vacuum-induction-plate.html
Samsung Hanwha J91741085 Smt Machine Parts Vacuum Induction Plate Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
winsouce.jpg)
