Electronics Forum | Mon Jul 26 06:32:58 EDT 2004 | cyber_wolf
Grant, The only thing that you really gain from refrigeration is a couple more months� shelf life. Refrigeration also seems to slow down flux separation. I am not sure how your paste consumption is, but we use ours up way before the expiration date
Electronics Forum | Thu Oct 27 08:38:04 EDT 2005 | jdengler
Simply leave the paste out at the end of the shift for the next days use. Keeping the paste refrigerated just prolongs the shelf life. Even if you are at the expiration date leaving the paste out for 36 hrs won't make any difference. Jerry
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2013-03-29 11:49:19.0
IPC — Association Connecting Electronics Industries® announces the appointment of industry veteran Randy Cherry as director of its new validation business unit.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
DOE for Process Validation Involving Numerous Assembly Materials and Test Methods DOE for Process Validation Involving Numerous Assembly Materials and Test Methods Selecting products that have been qualified by industry standards for use
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Emmanuelle Guene of Inventec Performance Chemicals will present on low voiding lead-free solder paste for high reliability applications
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and lead discussions on a wide range of topics, important for managing in times of transition and emerging stronger. Topics include: Technical Support and New Product Development in a Post-Pandemic World Going Forward: Evaluating and Validating New