Fast, Simple and Accurate Conformal Coating Inspection. CX150i™ automates inline conformal coating inspection process using a brand-new UV Strobed Inspection Module (SIM). Based on proven AOI technology, CX150i™ gives you the assurance of quality, c
Can be retrofitted for manual loading and unloading and for single-shuttle or dual-shuttle system. The SAR-1300-BD 2-Uni Stand-alone router, with single-shuttle or dual-shuttle system, has excellent retrofitting capability (2nd shuttle, 2nd milling h
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Thu Aug 21 09:34:57 EDT 2003 | davef
Woa. The more paste that you put a a BGA ball, the more likely that you'll bridge between balls. Why do you need to compensate for the size variance in BGA balls? How does using a 8 thou thick stencil to compensate for ball size variance? Fine pi
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2015-11-12 20:28:42.0
Nordson ASYMTEK introduces the Spectrum™ II Premier with the IntelliJet® jetting system for dispensing small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for advanced packaging applications. The IntelliJet system incorporates ASYMTEK's patent-pending 2-piece ReadiSet™ jet cartridge for fast and simple cleaning and maintenance.
Technical Library | 2014-11-18 23:59:30.0
Performance degradation of packaging material is an important reason for the lifetime reduction of LED. In order to understanding the failure behavior of packaging material, silicone and phosphor were chosen to fabricate LED samples within which an aging test at 125℃ was performed. The result of online luminance measurement showed that LED samples with both silicone and phosphor had the highest luminance decay rate among all test samples because the carbonization of silicone and the consequent outgassing reduced the luminance quickly. The result of the luminance variance with test time was analyzed and an exponential decay model was developed with which the lifetime of LED under high temperature could be estimated.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
STI is equipped with a state of the art 26,000 sq ft manufacturing area with the latest in high speed placement, inspection, and test equipment in addition to work cells to assemble complex box builds. Our personnel are uniquely qualified to assemble
Events Calendar | Thu Apr 15 00:00:00 EDT 2021 - Thu Apr 15 00:00:00 EDT 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
Career Center | , USA | Engineering
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Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking a Sr. Quality Engineer to join thier team! The Sr. Quality Engineer will act as the right hand man to the Quality Manager. Provides work direction for Quality Technician and Product/Process Auditors po
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_generic-footprints-for-capc-and-resc_topic2628.xml
;The smaller the package the slighter the solder joint goal variance. Here are the current Solder Joint Goal tables - uploads/3/Library_Expert_Solder_Joint_Goal_Tables.zipNote
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/100217-automated-grease-dispensing-for-automotive-switches
. This caused major process control issues as the dispensing tips would crash into parts that had a variance in thickness. Solution Liquidyn P-Jet CT jet valve EV Series automated dispensing system
