Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
RESAM is the American Representative for the Eric Drives, variable frequency motor controls and vector drives.
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
Used SMT Equipment | In-Circuit Testers
HP / Agilent 8753B Vector Network Analyzer, 300 kHz to 3 GHz with OPT 010 SKU9883 The HP Agilent 8753B Vector Network Analyzer operates from 300 kHz to 3 GHz The 8753B is ideally suited for component and network measurement. The 8753B has an integ
Used SMT Equipment | In-Circuit Testers
Agilent N5182A-503-651 MXG RF Vector Signal Generator Agilent-HP N5182A MXG RF Vector Signal Generator Featuring fast frequency, amplitude, and waveform switching, high power with an electronic attenuator, and high reliability -all in two rac
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
Quick Overview: Motor-driven MDS-710 With unique cutting method, the circuit board is cut by A, B, C, three groups of circular blades. The whole cutting process is divided into three stages which can reduce 80% stress compared with the traditional s
Events Calendar | Sun Feb 18 18:30:00 UTC 2024 - Sun Feb 18 18:30:00 UTC 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Wed Apr 21 18:30:00 UTC 2021 - Wed Apr 21 18:30:00 UTC 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Career Center | Colorado Springs, Colorado USA | Engineering,Research and Development
At least 5 years of experience in DESIGN of RF circuits up to 6 Ghz. We want a real designer who's actually made RF designs work -- not someone who managed or worked on a project that had something to do with RF. Experience and knowledge of the in
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/comprehensive-soldering/
Comprehensive Soldering Training Lead Free or Tin Lead Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
® 611 Hollingsworth Street P.O. Box 3836 Grand Junction, CO 81502 (970) 245-0408 FAX: (970) 245-9674 CF-8 Operating Instructions Manual CF-8 Axial Component Lead Former GPD Part No. 801-1-07 Serial No. NOTE
