Industry Directory | Manufacturer
Manufacturer of vertical in-line sputtering and etching systems
Industry Directory | Manufacturer
Manufacturers of Custom Thick Film Ceramic Substrates, Chip Resistors and Attenuators
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Since 1977, Barry Industries has manufactured the highest quality chip attenuators available. All chip attenuators are designed and manufactured in our 40,000 square foot facility in Attleboro, Massachusetts USA. Vertical Integration is our key to en
Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry
Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may
Electronics Forum | Tue Jan 05 13:26:13 EST 2021 | ppcbs
We are working to upgrade our BGA Rework Systems to place BGA's up to 150mm in size. We are encountering an issue that I wanted to pose to this group. When we get above 50mm in chip size, which is the field of view for the vision systems Prism, the
Used SMT Equipment | Chipshooters / Chip Mounters
Make: Samsung Model: SM421F Vintage: 2012 Details: (4) Spindle Head Assembly “On The Fly” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separatel
Used SMT Equipment | Chipshooters / Chip Mounters
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
.jpg)
Parts & Supplies | Chipshooters / Chip Mounters
156081 RUNNER, NOTCHED 156080 PANEL BRACKET,LEFT/REAR 156791 SUPPORT BRKT, SOLENOID AND PUMP 145324 SPEED CONTROLLER ASSY (VENTURI VAC. KIT) 145268 SOLENOID ASSY (VENTURI VAC. KIT) 145261 VACUUM CONNECTOR 14525
Parts & Supplies | Depanelizers / Routers
E20217290A0A YA Pulley Bracket L ASM JUKI SMT Pick and Place machine KE-730 JUKI E20167230B0 ZST BASE ASM JUKI E2016725000 CONVEYOR BELT C JUKI E2016755000 SUPPORT B JUKI E2016760000 J BELT HOLDER JUKI E2016855000 Z1 MOTOR SHAFT JUKI E201771
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
Panasonic Capacitor Feeder Loading the vertical electronic components in feeder, feeder supply components for pick and place machine to plug-ins. Electronic operation，Seamless communication with pick and place machine ，Real-time control,communi
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
: The F dimension for Toe Fillet for Class 1 & Class 2 Fabrication is: Wetting is evident on the vertical surface of the component terminal The F dimension for Toe Fillet for Class 3 Fabrication is: (G) + 25% (H) or (G
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=17
. To overcome these Nordson DAGE has introduced the first bond ball pull (FBBP) test method; the ball bond is gripped using a specialised tweezer jaw in such a way that a vertical load is applied to the bond thus enabling a pull test to be applied
