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CAD Design Software products run in the AutoCAD environment.
Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare
Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.
Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1
blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Used SMT Equipment | AOI / Automated Optical Inspection
Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari
Industry News | 2012-01-10 19:20:12.0
IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
eptac_05_19_10.PPT 1 Welcome to the EPTAC Webinar Series: IPC 2010 APEX Conference and IPC-A-610E, J-STD-001E, IPC-A-600H You are connected to our live presentation delivered via the internet
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/proportional-throughhole-padstacks_topic90_post64.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
