Industry Directory: via hole fill (42)

Uniwell (HK) Electronics Co.,ltd (uwellpcb.com)

Industry Directory | Manufacturer

UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

New SMT Equipment: via hole fill (113)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: via hole fill (778)

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

Used SMT Equipment: via hole fill (8)

Nordson DAGE X-RAY XD7500

Nordson DAGE X-RAY XD7500

Used SMT Equipment | X-Ray Inspection

• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div

Tekmart International Inc.

Industry News: via hole fill (318)

See GPD Global's PCD Dispensing in Action at the SMTA Houston Expo & Tech Forum

Industry News | 2011-02-07 15:23:56.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

GPD Global

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

Parts & Supplies: via hole fill (1)

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Technical Library: via hole fill (33)

Solder Mask Dispensing For Electronics and Aerostructures

Technical Library | 2023-08-16 18:09:06.0

One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably.

GPD Global

Via Filling Applications in Practice

Technical Library | 2020-07-15 18:49:03.0

Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias

Würth Elektronik GmbH & Co. KG

Videos: via hole fill (54)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Training Courses: via hole fill (8)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: via hole fill (4)

Upper Midwest Chapter: 33rd Annual Golf Tournament

Events Calendar | Thu Aug 22 00:00:00 EDT 2024 - Thu Aug 22 00:00:00 EDT 2024 | Prior Lake, Minnesota USA

Upper Midwest Chapter: 33rd Annual Golf Tournament

Surface Mount Technology Association (SMTA)

7th Annual Ohio Valley Chapter Member Appreciation Golf Outing

Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Tue Jun 11 00:00:00 EDT 2024 | Uniontown, Ohio USA

7th Annual Ohio Valley Chapter Member Appreciation Golf Outing

Surface Mount Technology Association (SMTA)

Career Center - Jobs: via hole fill (6)

SMT Machine Operator

Career Center | Valley View, Ohio USA | Production

Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en

Manpower Professional

Regional Sales Manager

Career Center | , Florida USA | Sales/Marketing

Multinational Florida-based company seeks dynamic sales professional to fill the position of Regional Sales Manager. The qualified individual will have a strong background in electronic manufacturing services and sound knowledge of the electronic co

Personnel Concerns, Inc.

Career Center - Resumes: via hole fill (12)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: via hole fill (437)

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: via hole fill (961)

PCB Libraries Forum : smallest via hole that can use a +/- 3 mils

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_smallest-via-hole-that-can-use-a-3-mils_topic2497.xml

PCB Libraries Forum : smallest via hole that can use a +/- 3 mils PCB Libraries Forum : smallest via hole that can use a +/- 3 mils This is an XML content feed of

PCB Libraries, Inc.

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill

GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global


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