Industry Directory: via hole fill (42)

Uniwell (HK) Electronics Co.,ltd (uwellpcb.com)

Industry Directory | Manufacturer

UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

New SMT Equipment: via hole fill (107)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: via hole fill (776)

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

Used SMT Equipment: via hole fill (8)

Nordson DAGE X-RAY XD7500

Nordson DAGE X-RAY XD7500

Used SMT Equipment | X-Ray Inspection

• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st

Qinyi Electronics Co.,Ltd

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div

Tekmart International Inc.

Industry News: via hole fill (316)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

Parts & Supplies: via hole fill (1)

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Technical Library: via hole fill (33)

Solder Mask Dispensing For Electronics and Aerostructures

Technical Library | 2023-08-16 18:09:06.0

One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably.

GPD Global

Via Filling Applications in Practice

Technical Library | 2020-07-15 18:49:03.0

Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias

Würth Elektronik GmbH & Co. KG

Videos: via hole fill (54)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Training Courses: via hole fill (8)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: via hole fill (4)

Upper Midwest Chapter: 33rd Annual Golf Tournament

Events Calendar | Thu Aug 22 00:00:00 EDT 2024 - Thu Aug 22 00:00:00 EDT 2024 | Prior Lake, Minnesota USA

Upper Midwest Chapter: 33rd Annual Golf Tournament

Surface Mount Technology Association (SMTA)

7th Annual Ohio Valley Chapter Member Appreciation Golf Outing

Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Tue Jun 11 00:00:00 EDT 2024 | Uniontown, Ohio USA

7th Annual Ohio Valley Chapter Member Appreciation Golf Outing

Surface Mount Technology Association (SMTA)

Career Center - Jobs: via hole fill (6)

SMT Machine Operator

Career Center | Valley View, Ohio USA | Production

Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en

Manpower Professional

Regional Sales Manager

Career Center | , Florida USA | Sales/Marketing

Multinational Florida-based company seeks dynamic sales professional to fill the position of Regional Sales Manager. The qualified individual will have a strong background in electronic manufacturing services and sound knowledge of the electronic co

Personnel Concerns, Inc.

Career Center - Resumes: via hole fill (12)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: via hole fill (437)

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: via hole fill (961)

PCB Libraries Forum : smallest via hole that can use a +/- 3 mils

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_smallest-via-hole-that-can-use-a-3-mils_topic2497.xml

PCB Libraries Forum : smallest via hole that can use a +/- 3 mils PCB Libraries Forum : smallest via hole that can use a +/- 3 mils This is an XML content feed of

PCB Libraries, Inc.

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill

GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global


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