Industry Directory: via hole on solder pads (1)

PCB Assembly Express

Industry Directory | Consultant / Service Provider

PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.

New SMT Equipment: via hole on solder pads (5)

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

PCB Manufacturing - USA

PCB Manufacturing - USA

New Equipment | Assembly Services

Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e

PNC Inc.

Electronics Forum: via hole on solder pads (239)

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 00:25:28 EDT 2011 | alcatel

I have one pcb which has via holes on both solder pads of 0402 chips. Right now im using type 3 solder paste with 45 degree squeegee. and a lot of these chips are tombstoning. Im guessing with larger particle size of solder paste, the solder will

Industry News: via hole on solder pads (29)

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

Industry News | 2018-05-22 12:19:27.0

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: via hole on solder pads (1)

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Technical Library: via hole on solder pads (2)

Fill the Void IV: Elimination of Inter-Via Voiding

Technical Library | 2019-10-10 00:26:28.0

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."

FCT ASSEMBLY, INC.

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

Videos: via hole on solder pads (6)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views.

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views.

Videos

Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net

BEST Inc.

Training Courses: via hole on solder pads (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

Express Newsletter: via hole on solder pads (995)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo

Partner Websites: via hole on solder pads (1082)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

of the void relative to the soldered interfaces where fatigue cracks are expected to propagate (see Figure 2). Because the voiding is not always centered in the solder sphere or on the pads (see x-ray images), cross sectional images may not represent

Heller Industries Inc.

ezLOAD Replacment Pads

| https://pcbasupplies.com/ezload-replacment-pads/

ezLOAD Replacment Pads Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick


via hole on solder pads searches for Companies, Equipment, Machines, Suppliers & Information

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

SMTAI 2024 - SMTA International

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Potting and Encapsulation Dispensing

Wave Soldering 101 Training Course
PCB Handling Machine with CE

Best Reflow Oven
Electronic Solutions

High Throughput Reflow Oven


World's Best Reflow Oven Customizable for Unique Applications