New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W
Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
. The VIA series plasma treatment systems utilize a patented plasma technology to produce superior uniformity at high throughputs. The VIA series for large-panel plasma processing is available in various chamber sizes, with choice of vertical or horizontal panel configurations
| https://www.eptac.com/soldertip/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/
: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39
