Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
One-Stop Solution for PCB & Prototype Assembly Expanded PCB manufacturing capabilities to support advanced designs with demanding requirements including laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Mon Sep 24 20:33:34 EDT 2001 | davef
Assuming you're seeing this during wave solder, the via acts like a heat pipe conducting 450�F [or whatever] air to your solder balls. Check the fine SMTnet Archives for similar threads and perspective on the direction to take.
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802-V6 Acterna Ethernet and Fibre Channel services module with FST2000 TestPad The FST2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troub
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshooting these variou
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2024-07-24 01:18:03.0
Quad Flat No-Lead (QFN) packages has become very popular in the industry and are widely used in many products. These packages have different size and pin counts, but they have a common feature: thermal pad at the bottom of device. The thermal pad of the leadless QFN provides efficient heat dissipation from the component to PCB. In many cases, arrays of the thermal via under the component is used to dissipate heat from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side.
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
VIA High Volume Series | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
ORION Industries | http://orionindustries.com/pdfs/silpad400.pdf
. Special Thicknesses, Rolls and Sheets Sil-Pad 400 can be supplied on special order in a variety of thicknesses from .007 to .045 inches to fulfill special requirements of insulation path minimums or other spacing needs
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
