Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma
What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?
Electronics Forum | Mon Apr 12 22:22:01 EDT 2004 | davef
Large voids are common in via in pad [seach the fine SMTnet Archives for earlier laments], especially in blind via. Observations on your via out gassing theory: * If the copper plating on your via is GT 1 thou, there will be no outgassing from the
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2015-03-16 06:51:04.0
Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Dissolved Gas Spreads Out Through Diffusion. Board The dissolved gas spreads throughout medium by diffusion. When it reaches the edge it escapes through outgassing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/ipc-apex-expo-2017
. Additionally, material characteristics such as viscosity, needle drip, and outgassing of air bubbles present similar process challenges. Nordson ASYMTEK’s Heakyoung Park will host a panel discussion with industry experts