Industry Directory | Consultant / Service Provider / Manufacturer
BBG will service your quick turn prototype, your small volume run as well as your full production requirement. We have plants dedicated to quick turn, small volume and prototype applications.
Industry Directory | Consultant / Service Provider / Manufacturer
Providing production and prototype, SEC offers advanced technologies like LED thermal management, heavy copper, PTFE for RFMW, open and internal cavities and blind and buried vias that are certified to a diverse set of industries.
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef
Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
SMTnet Express, June 24, 2021, Subscribers: 26,990, Companies: 11,385, Users: 26,722 Filling of Microvias and Through Holes by Electrolytic Copper Plating — Current Status and Future Outlook The electronics industry is further
ASCEN Technology | https://www.ascen.ltd/Blog/list_3_26.html
.... Read more radial components forming machine we need do radial lead forming process by the radial components forming machine via the component plug-in standard before plug-in processing
