Electronics Forum: via pollution (1)

Power component thermal via

Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel

I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the

Industry News: via pollution (6)

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Mobile soldering fume extraction unit of the next generation

Industry News | 2019-11-27 01:33:15.0

ULT AG recently introduced the mobile soldering fume extraction unit LRA 160.1 for small and medium air pollutant quantities

ULT Canada Sales Incorporated

Technical Library: via pollution (1)

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

Express Newsletter: via pollution (148)

SMTnet Express - July 3, 2019

SMTnet Express, July 3, 2019, Subscribers: 32,112, Companies: 10,820, Users: 24,903 Reduce Pollution of Process Gasses in an Air Reflow Oven Credits: Vitronics Soltec The introduction of lead-free solders resulted in a selection of different

Partner Websites: via pollution (11)

Système de dépose d'adhésif thermofusible Freedom | Nordson Corporation

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/adhesive-dispensing-systems/products/melters/freedom-hot-melt-dispensing-system

Système fermé doté d'un dispositif de remplissage automatique pour éliminer la pollution et les débris Peut être monté presque partout et permet de placer les commandes au niveau des yeux Fond et dépose l'adhésif dans un délai pouvant être réduit de 70 % Commandes via écran tactile Optix™

ASYMTEK Products | Nordson Electronics Solutions


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