Industry Directory | Manufacturer
Manufacturer of flex, rigid-flex, and rigid circuit boards. We offer prototype and production delivery options. We manufacture commercial, military, medical and industrial jobs and offer value added services such as assembly. We can customize services to fit your needs, such as gold or white tin plating, plugged or blind vias, etc.
Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8350B The totally programmable features and internal memory of the 8350B Sweep Oscillator Mainframe can speed up your repetitious testing needs. A push of a button returns the unit to local control for bench work. Sweep frequency
Used SMT Equipment | General Purpose Test & Measurement
Agilent Keysight E8361A 67 Ghz PNA Network Analyzer This and 400+ other quality test systems available via online auction. Please visit www.xlineassets.com for details. Auction starts soon!!! Equipment Manufacturers: Agilent/HP Tektronix
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
Imagineering, Inc. | https://www.pcbnet.com/blog/making-the-most-of-smaller-components-with-hdi-pcbs/
. VIPPO Structure The increasing usage of HDI printed circuit boards makes the plugging of micro-vias an important aspect of PCB manufacturing
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
2.5.6 Cap Plating 22 A-600 Additions 2.5.6 Cap Plating 23 2.9.7 Tenting of Via Holes Clarification of terms. 24 Added Section 2.10.1.3 Conductor Thickness 25
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