Use Visual Components to test, collaborate, communicate and confirm in visually rich 3D graphics via the Web.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Sat Aug 28 11:03:44 EDT 2004 | mariels
We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks
Used SMT Equipment | AOI / Automated Optical Inspection
This item is part of our online equipment auction happening right now. The bidding for this auction begins closing on Thursday, 12/9, at 1pm EST. Click the following link to view more photos and details: https://bajabid.hibid.com/lot/107722753
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-02-04 01:47:14.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Circuit Board Assembly Products
Feeder Parts PCB Board Assembly NEW Condition 40007370 smt feeder parts for juki fx-1 r base-feeder pcb 40007370 copy new Describtion: Part Number: 40007370 Part name: feeder cover condition: copy new Application: JUKI feeder parts : We st
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Aug 22 00:00:00 EDT 2023 - Tue Aug 22 00:00:00 EDT 2023 | Boca Raton, Florida USA
Space Coast Panel Discussion: Microscope Setups, Getting the Best Results From Your Equipment
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Career Center | Chicago, Illinois USA | Production
North side manufacturing company seeks experienced SMT operator for pick and place, printer, and reflow oven machines. Experience operating wave solder machine also required. Please send resumes to 773.275.0283(fax) or via email to jhagerman@jeron.co
Career Center | San Jose, California USA | Management
DCSI is one of the most trusted and respected global executive search and solutions companies inthe electronics manufacturing industries. We have more than 35 active openings that range from Managers, Directors, Sr. Directors, Vice Presidents, to EV
Career Center | Titusville, Florida USA | Human Resources
Interview scheduling via Leo/Zoom, onsite, travel, onboard integration to include directors, HR staffing and interns, Welcome First Day communications, Sterling BGI support, Prehire Covid tracking, I9 administration, college team surge support, Y1X
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/polymer-processing-systems/products/polymer-valves/3-2-way-valves
Válvula de 3/2 vias BKG® HyFlex™ | Válvula alternadora de 3/2 vias (desvio em 90°) | Nordson POLYMER PROCESSING SYSTEMS Polymer Processing Systems BKG – EDI Empresa | Diretório global | Idiomas
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-microvias-and-printed-circuit-boards/
. What Are Vias in a Printed Circuit Board? Most printed circuit boards on the market today are built with several dielectric layers, surfaces that are polarized so that electricity
