Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2024-02-19 11:36:31.0
Ucamco is proud to release UcamX v2023.12 and Integr8tor v2023.12. These new versions of our CAM and Pre-CAM software include plenty of additions to increase our customers' productivity, highlighted by the topics below.
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. IV. Drilling and Vias Holes are then drilled through the substrate for through-hole components and vias. Through-holes accommodate the leads of certain components, such as capacitors and ICs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/landing/via-2-5-series
? Are You Getting to the Bottom of Your Via? New VIA™ Series 2.5 cleans deep, narrow vias where other processes can’t go! PCB panels are becoming thicker, via trenches deeper, and via openings smaller
