Industry Directory: vippo (1)

XPCB Limited

XPCB Limited

Industry Directory | Manufacturer

XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.

Industry News: vippo (3)

SMTA China Presents Nine Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China East 2014 Conference/NEPCON China 2014

Industry News | 2014-05-12 16:06:39.0

SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Best Technical Papers at IPC APEX EXPO 2020 Selected

Industry News | 2020-01-20 16:42:42.0

The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.

Association Connecting Electronics Industries (IPC)

Technical Library: vippo (1)

Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle

Technical Library | 2019-05-15 22:26:02.0

As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.

Cisco Systems, Inc.

Express Newsletter: vippo (1)

SMTnet Express - May 16, 2019

increases, Via-In-Pad Plated Over (VIPPO) has b

Partner Websites: vippo (4)

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

listed below: 2016: Mathias Nowottnick, Ph.D., University of Rostock " Comparison of Active and Passive Temperature Cycling " 2015: Matt Kelly, P.Eng, MBA, IBM Corporation "Via-in-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and

Surface Mount Technology Association (SMTA)


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