Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Tue Oct 10 13:32:26 EDT 2006 | rsteele
Does anyone know of any tests or testing done on the peel strength of components to pads. I have alot of info on FAB level peel strength testing, but nothing on components themselves. Is there any process(es) to test and insure new pastes and reflo
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2021-05-21 03:59:59.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.
increases, Via-In-Pad Plated Over (VIPPO) has b
ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
) for electrical properties, under their file number E39505 for Kapton® polyimide film. Properties of Type FN Film Heat Seal Strength Film-to-Film Seals The peel strength of heat seals between the coated and uncoated sides of one-side coated Kapton®
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/
. Some things to include are: Mechanical strength Electrical conduction Purity Soldering quality Lamination – Peel and strength Hole wall quality Component polarity, placement, alignment, positioning, etc
