SEMI-THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems.
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Scienscope supplies inspection equipment, including stereo zoom microscopes, video an X-Ray inspection equipment, automated optical inspection systems, magnifiers, measurement systems.
New Equipment | Rework & Repair Services
Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
Electronics Forum | Wed Jul 13 11:57:08 EDT 2016 | ahernand75
Guys I'm looking for a software on the web that I can use to do void measurements. I have x-ray images but unfortunately no software in the machine to be able to calculate void size. Thanks in advance for your support.
Electronics Forum | Fri Sep 09 05:58:58 EDT 2016 | jswatt
yoru x-ray supplier should be able to help however you can do a rough cut calculation byt just printing it out and measuring it, your interested in ration (%) of the void and where in the joint it is to tell you it it's really an issue. Also importan
Used SMT Equipment | X-Ray Inspection
Make: Glenbrook Model: Jewel Box 90T Year: 2016 Type: X-Ray Inspection Details: The Glenbrook JewelBox 90T is a high-resolution, real-time X-ray inspection system designed for precision i
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sam
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 09:16:42.0
New Technology for Void-free Reflow Soldering
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
0.5Cu 217-219 20-38 200±30 11.5±1.0 0 ROL0 S3X58-M650-7 Drastic improvement of pin testability halogen free solder pasteHigh meltability reduces voiding Securing contact between the testing probe and the solder joint,S3X58-M650-7
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
pixels in order to have a fair measurement. Once a ball diameter has been defined, the system can automatically determine the level of voiding within each defined BGA ball. A second gray level threshold is applied against which all pixels within each
