Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Thu Jun 21 18:20:25 EDT 2018 | vinitam
Hello, My company manufactures MLB's and is currently experiences so many voids due to a mistake in direct metallization (shadow line). We have tried testing every chemical component in the line and every possible maintenance. The scrap rate is goi
Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/3d-electronics-as-an-alternative-to-printed-circuit-boards-pcbs/
. Offering complete circuits to be integrated within an object, 3D electronics are on the rise as they continue to undergo extensive innovation, metallization methods, and manufacturing methodologies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=13
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
