New SMT Equipment: voids in pin paste soldering (18)

SMT Semi Automatic Screen Printer for pcb board size 1200mm in smt LED production line

SMT Semi Automatic Screen Printer for pcb board size 1200mm in smt LED production line

New Equipment | Printing

SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45

Shenzhen Honreal Technology Co.,Ltd

Semi-Auto Solder Printer for solder paste applier machine in SMT Production YS350/600/1200

Semi-Auto Solder Printer for solder paste applier machine in SMT Production YS350/600/1200

New Equipment | Printing

--------------------------------------------------- Skype:tonny-neoden Email:neoden@neodentech.com Mobil:86-13588787940 --------------------------------------------------- Video link: https://www.youtube.com/c/NeoDenTechnology YS350  Specific

NeoDen Tech Co.,Ltd.

Electronics Forum: voids in pin paste soldering (139)

Solder voids in PTH

Electronics Forum | Tue Feb 19 23:00:29 EST 2008 | amarpreet41

Connector pin - 10.83 mils Hole dia - 27 - 33 mils. We are trying to find the optimam level for hole dia.

voids in solder

Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL

Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?

Industry News: voids in pin paste soldering (74)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Technical Library: voids in pin paste soldering (5)

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2023-11-14 19:24:08.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.

Vitronics Soltec

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Videos: voids in pin paste soldering (4)

SMT Semi Automatic Screen Printer for pcb board size 1200mm in smt LED production line

SMT Semi Automatic Screen Printer for pcb board size 1200mm in smt LED production line

Videos

SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45

Shenzhen Honreal Technology Co.,Ltd

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

Videos

Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti

MatriX Technologies GmbH

Training Courses: voids in pin paste soldering (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

Events Calendar: voids in pin paste soldering (2)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

Juarez Chapter Webinar: Pin in Paste

Events Calendar | Thu Oct 28 00:00:00 EDT 2021 - Thu Oct 28 00:00:00 EDT 2021 | ,

Juarez Chapter Webinar: Pin in Paste

Surface Mount Technology Association (SMTA)

Express Newsletter: voids in pin paste soldering (1018)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: voids in pin paste soldering (403)

Are Voids in Solder Joints Really an Issue?

| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue

Are Voids in Solder Joints Really an Issue? Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena

The Application of the Pin-in-Paste Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/te_news_industry/2021-08-31/23962.chtml

The Application of the Pin-in-Paste Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T


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