Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Manufacturer
Michmas Electronics Ltd. provides comprehensive electronic circuit and assembly solutions. From prototyping to full-scale production, we handle project management, PCB production, component procurement, and circuit assembly
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Apr 15 08:24:48 EDT 2008 | pima
Hello I would like to ask you what kind of production do u treat for high mix and low volume. I mean what is your definition for this high mix and low volume - is 5 changovers for shift is high mix and low volume technology? And what kind of SMT p
Electronics Forum | Mon Oct 25 19:15:41 EDT 1999 | nards
Hello, Is the volume of flux paste critical over reflow temp. profile and belt speed?. thanks, nards
Used SMT Equipment | SMT Equipment
Model No：KS-6004-S Portable conveyor Cycle time：Approx 15seconds Power supply：100-230V AC (customized), single phase Power load：Max 150V/A Air pressure： 4-6 bar Air volume：MAX 10L/minute Transport height：900±20mm (or customized) Transport di
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Parts & Supplies | Assembly Accessories
SAMSUNG CP30 M1, M2 , M3 SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 SAMSUNG CP40 N045 / N08 / N14 / N24 / N40 / N75 SAMSUNG CP45 FV TN030 /TN040 / TN065 / TN110/TN140 / TN220 SAMSUNG CP45 FV TN400 / TN750 / TN1100 SAMSUNG SM320 / CP45 NEO CN0
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-16 18:16:05.0
A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Career Center | , Tennessee USA | Management
We are searching for an experienced process engineering manager to join our organization!! We need an individual knowledgeable of high speed high volume manufacturing process. Ideal individuals -Will possess a BSEE or BSEET -3 plus years of managem
Career Center | San Jose, California | Production
Looking for an experienced sprayer of acrylics, polyurethanes, silicones & epoxies. Experience with HVLP equipment, mixing of materials (by weight & by volume). Able to follow process instructions, read Technical data sheets and apply coating to de
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: A Comprehensive Guide
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/valves/003-series-volume-metering-valves
003 Series Volume Metering Valves Nordson SEALANT EQUIPMENT Corporate | Global Directory | Languages Division Only All of Nordson Products Valves Meters
Heller Industries Inc. | https://hellerindustries.com/1913mk7-2/
High Volume Reflow Oven -1913 Home » 1913MK7 1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min
