Industry Directory | Manufacturer
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
New Equipment | Assembly Services
> 6Spindle, 6 Flying Vision (FOV 24mm) Head -Batch recognition with 6 cameras while picking up 6 components -Processable components: 0402 ~ 21mm, H12mm >> Low-noise, low-vibration high-speed placement with Linearmotor -Suitable for Y-axis Linear Moto
New Equipment | Assembly Services
Hanwha HM520 HS SMT Assembly Line Hanwha HM520 HS SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Electronics Forum | Sun Oct 26 09:05:09 EDT 2008 | tony_d
Hello INGE FI, I know what you are going through. A few years back, I was faced with having to purchase AOI equipment for my business. My selection team and I looked at several different AOI manufacturers. We found that only two AOI vendors were sui
Electronics Forum | Fri Aug 30 19:43:21 EDT 2024 | engineer4
I have extensive use in both AOI and SPI. When looking to buy an AOI all of the major players can do well in SMT applications, but for me Parmi stands out at the top. Parmi seems to stand out especially in chip and wafer inspection. Their U/I is ve
Used SMT Equipment | AOI / Automated Optical Inspection
Single lane 3 position conveyor; 12" x 12" work area; 5MP camera; die bond and wire bond inspection.
Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Industry News | 2018-12-08 03:20:37.0
Top Silicon Wafer Manufacturing Companies in the World
Parts & Supplies | AOI / Automated Optical Inspection
AV131 N210028285AA BENDING DIE
Parts & Supplies | AOI / Automated Optical Inspection
N210028285AA BENDING DIE for AV131
Technical Library | 2020-05-26 22:28:56.0
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
Technical Library | 2022-06-27 16:50:26.0
Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
LSMO-105 fastest and most reliable stencil inspection machine www.aoivision.com
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
attribute inspections of potentially counterfe
SMTnet Express, May 28, 2020, Subscribers: 28,990, Companies: 11,012, Users: 25,834 Head-on-Pillow Defect Detection - X-ray Inspection Limitations Credits: Ericsson AB Both the number and the variants of Ball Grid Array packages (BGAs) are tending
| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print
>> SMT Technical Size Does Matter – Breaking the Barriers of Wafer Level Packaging Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
) Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Silver Wire-bonding Stacked Die System in Package (SiP) Through Silicon Vias (TSVs