Industry Directory | Manufacturer
As leading cleaning technology company in China, we have more than 15 years experiences in SMT, Semi-conductor and Screen printing cleaning industries.
Industry Directory | Manufacturer
We are a SMT handling machine and Cleaning machine manufacturer.
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Electronics Forum | Fri Apr 22 05:01:19 EDT 2011 | azrina
Hi, I am doing my master degree in flux cleaning process for flip chip assemblies and required to establish a new receipt for flux cleaning. currently, i am doing screening process for the parameters involve ; temp,pressure, surfactants, speed and a
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Used SMT Equipment | Semiconductor & Solar
· Dual Magnification, auto-focusing Optical System · DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle · Front loaded dual Cassette Compartment · Inspection Drawer - also used for single wafer load/unload · Dress Wafe
Used SMT Equipment | Drying Equipment
BRAND : SUPER DRY -02 SERIES MODEL : SD-3032-02 DESCRIPTIONS : "02 series are equipped with 1 patented dry unit to constantly main
Industry News | 2021-06-26 09:04:13.0
Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.
Industry News | 2008-01-23 10:59:08.0
San Jose, CA - �The International Wafer-Level Packaging Conference (IWLPC) has issued a call for papers for its fifth annual program on Oct. 13-16 at the Wyndham Hotel in San Jose.
Parts & Supplies | Board Cleaners
LOT OF 4, UNDER SCREEN CLEANING FABRIC Screen cleaning Rolls are essential components in keeping stencil printing machines clean and effective. Individual manufacturers configure their systems differently to use specific sizes and designs of unde
Technical Library | 1999-05-06 14:44:11.0
Semiconductor device manufacturers face many difficult challenges as we enter the 21st century. Some are direct consequences of adherence to Gordon Moore's Law, which states that device complexity doubles about every 18 months. Feature size reduction, increased wafer diameter, increased chip size, ultra-clean processing, and defect reduction among others are manifestations that have a direct bearing on the cost and quality of products, factory flexibility in responding to changing technology or business conditions, and on the timelines of product delivery to the ultimate customer.
Nano-copper sintering in formic acid vapor.
Fully automatic stencil cleaning system MLPBT-750 Application fields of "MLPBT-750 steel mesh cleaning machine": ●Suitable for cleaning various types of stencils such as steel mesh, copper mesh, microporous mesh, and wafer tray [see the following fi
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , South Carolina | Engineering
Assembly engineer with leadership capabilities needed for this position. Implement the proper controls to assure a reliable operation of the strap/inlay assembly, strap attach, and slitting processes. Actively pursue opportunities to continually imp
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Screen and Stencil Printing Processes for Wafer Backside Coating News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/sphere-wafer-series
bumping, organic contamination removal, and wafer destress. Wafer Cleaning - The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes 中文 MEMBERS LOGIN Membership Become a Member
