Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2021-09-16 06:16:18.0
VJ Electronix, Inc. is pleased to announce that BAE Systems Inc. has been using the XQuik II to solve an industry-wide problem with the industry-standard Waffle Pack design.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/polymer-processing-systems/products/screen-changers/screen-pack
: Efficiente filtrazione degli elementi contaminanti, ad es. fibra, legno, carta, punti neri, gel Maggiore vita utile del pacchetto filtro, maggiore produttività
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-522.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
