New Equipment | Board Handling - Storage
The ACS1100 intelligent automatic warehouse for SMD coils has been specially designed and made to achieve an optimum performance as regards storage capacity and total size. With a maximum total capacity of 1100 reels, the ACS1100 is the optimum sol
New Equipment | SMD Reel Storage
The ACS400 intelligent dynamic warehouse for SMD/PTH carriers and components has been developed to satisfy the storage needs of the most varied types of elettronic and others components. With the possibility of configuring up to 480 different positi
Electronics Forum | Sat May 28 01:26:39 EDT 2011 | remoh622
What is the industry ideal humidity level to be maintain?
Electronics Forum | Mon Jan 10 13:59:54 EST 2005 | mdemos1
Hi. I am looking for information on storing completed PCBAs in a warehouse environment. My current assemblies use standard FR4 material - 4 to 6 layers. Component types range from 0402s to fine pitch QFPs and micro-BGAs. If I were to store this i
Industry News | 2013-03-22 14:12:00.0
Storagesolutions, today announced that it will exhibit together with its distributor ORTEC MARKETING, EQUIPMENT & SUPPLY LTD in booth 41A at the New Tech Exhibition, scheduled to take place May 7-8, 2013 at the Tel Aviv Fairground in Israel.
Industry News | 2013-04-24 11:21:02.0
Storagesolutions, today announced that it will exhibit in booth 8D036 at the Electronics & Automation 2013 trade fair, scheduled to take place May 28-30, 2013 at the Royal Dutch Jaarbeurs, Utrecht in The Netherlands.
Technical Library | 2024-06-19 15:23:54.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.
JUKI Automation Systems at the IPC Apex 2015; showcasing Intelligent Storage Systems.
JUKI Automation Systems at the IPC Apex 2015; showcasing Intelligent Storage Systems.
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