Supplier Representative & Consulting Services Provider Company. Sevices for a wide variety of processes and manufacturing technologies: All SMT, Area Array, Flip Chip, Pb Free, etc. Test & Lab Services, Assembly Materials, Warp Analysis, Asset Manag
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Used SMT Equipment | SPI / Solder Paste Inspection
Koh Young 3030VAL SPI Vintage: 11/2007 3D Vision SMEMA conveyor with Bottom Up Side Edge Clamping Measures: Volume, Height, X/Y position, area Voltage Requirement: 200-240V Includes: (Base Unit, 1 Programming Seat, Real Time 3D viewer, Bare Board
Industry News | 2014-03-19 13:27:35.0
Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.
Industry News | 2019-01-10 16:30:44.0
NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.
Technical Library | 2024-10-26 06:26:24.0
Copper pour is an essential design element in printed circuit boards (PCBs) that enhances thermal management, signal integrity, and electrical grounding. It involves filling unused areas on the board with copper, connecting them to power or ground planes. This feature helps manage heat dissipation, minimizes electromagnetic interference (EMI), and provides stable electrical grounding for complex circuits. While copper pour offers significant benefits, improper implementation may lead to manufacturing challenges like warping or soldering difficulties. This article explores the advantages of copper pour, the potential challenges, and how PCB Power integrates this design feature to optimize performance and durability. With advanced manufacturing processes, PCB Power ensures seamless copper pour integration for prototypes and large-scale production, offering turnkey PCB solutions for various industries.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/gauges-and-instruments?con=t&page=5
(Circuits Assembly magazine, January 2006) (PDF 467 KB) Board Warp Sensing Nordson SELECT The Board Warp Sensing system measures the height differences of a printed circuit board assembly as it is preheated and calculates the downward deflection
| https://www.eptac.com/faqs/ask-helena-leo/page/9
5.2.6 on max warp this part should be? Read More Component Encapsulation QUESTION Question: Do you know of an encapsulant material that is Military Grade and can be used on a SOT-23
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