Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Thu May 23 10:21:19 EDT 2019 | emeto
What is the material of this PCB?
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Used SMT Equipment | SMT Equipment
Features: 1. Heating system 1.1 Independent heating models are located with top and bottom with single hot air circulation in each zone. 1.2 All the heating zones are controlled by PLC through PLD, 1.3 Each zone is heated step by step, thus reducin
Industry News | 2015-05-18 10:27:49.0
Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.
Industry News | 2023-06-12 21:13:08.0
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express January 31, 2013, Subscribers: 26152, Members: Companies: 9105, Users: 34242 Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages There are three key industry trends that are driving
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
SMT Components During Reflow Float Off Pads - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.smtfactory.com/How-to-prevent-static-electricity-during-the-operation-of-the-Full-auto-SMT-Production-Line-id3182659.html
How to prevent static electricity during the operation of the Full-auto SMT Production Line? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
