Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards
Electronics Forum | Tue Oct 07 08:44:49 EDT 2014 | emeto
Hi, 1. I will run the board on the mesh if single sided. 2. For double sided board, I will try stiffeners. 3. If stiffeners don't work, then you have to create a handling fixture(holds the board and has enough openings to let the air flow to the PC
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Parts & Supplies | Pick and Place/Feeders
Best regards wendy Email: wendy@leadersmt.com Whatsapp: +86 13148795469
Parts & Supplies | Pick and Place/Feeders
Best regards wendy Email: wendy@leadersmt.com Whatsapp: +86 13148795469
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
The following video guides the user through a typical data collection process. These steps may vary depending on the process your company uses. Categories: WaveRIDER, WaveRIDER SPC (v5.2x)
Led bulbs production line in India 2019 July newly installed contact : skype id : peter.huang187 , Mobile : 0086-13610497541 email : leadsmtmachines@163.com
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/aa7ag00-nozzle-correction-fixture-216235?page=22&order=name+desc
FUJI nozzle correction fixture AA7AG00 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products nozzle correction fixture Public Pricelist Public Pricelist
| https://www.wesource.com/ict/in-circuit-test/agilent-e4033c-ict-pin-verification-fixture-id-140408/
! Newsletter Email Address: Click here to unsubscribe Agilent E4033C ICT Pin Verification Fixture ID_140408 Home > ICT/In-Circuit Test Click to enlarge More images Agilent E4033C ICT Pin Verification Fixture ID_140408 Agilent E4033C ICT Pin Verification Fixture ID_140408 Agilent E4033C ICT Pin Verification
