Industry Directory | Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Thu May 23 10:21:19 EDT 2019 | emeto
What is the material of this PCB?
Used SMT Equipment | Preheaters
PCB flatness Inspection Machine PCB, warpage bending defect detection Inspection Range : 0 ~2000um
Used SMT Equipment | SPI / Solder Paste Inspection
Mirtec MS-11e In-Line 3D SPI Model: MS-11e Year: 2018 15 Mega Pixel Camera High Speed 3D In-Line SPI MachineExclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Pixel Precision Telecentric Compound Lens Design Precision Closed Loop AC Servo
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Industry News | 2012-02-23 14:43:13.0
IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Technical Library | 2011-06-09 13:29:17.0
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/514.html
*750mm Thickness 12-40mm PCB Max size 1500L*350mmW PCB Min size 80L*50mmW PCB Thickness 0.8-6mm PCB Warpage Max.PCB diagonal line 1% Transport Height 900
| https://www.smtfactory.com/I-C-T-3D-Aoi-Optical-Inspection-Machine-For-Pcb-pd49400944.html
(Test deviation accuracy less than ±0.25mm. 6. Camera move,conveyor fixed during test. 7.PCB warpage conpensation:total Mark compensation calibration,conponent position frame compensation
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
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