Electronics Forum: wassink (53)

Soldering in electronics (R.J. Klein Wassink)

Electronics Forum | Tue Jul 19 04:44:52 EDT 2016 | pavel_murtishev

Hello, Unfortunately I have lost my hard copy of "Soldering in electronics" by R. J. Klein Wassink. Is it possible to purchase electronic copy of the book on the net? Having googled a couple of hours, I have found nothing. Any input is highly appr

Zn/Pb Diffusion

Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef

I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic

Industry News: wassink (1)

UPMG Honors STI Electronics, Inc. with the Opening of the Jim D. Raby Hall of Fame

Industry News | 2012-06-04 16:10:02.0

STI Electronics, Incannounces that UP Media Group Inc. (UPMG), publisher of CIRCUITS ASSEMBLY magazine, has opened the Jim D. Raby Hall of Fame for Electronics Assembly.

STI Electronics

Events Calendar: wassink (1)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

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The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder

Heller Industries Inc.


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