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Nitrogen Hot Air Circulation Reflow, Screen Printer, Wave Soldering, Double Unloader, Inverter Machine, 90° PCB Transfer Buffer Loader & Unloader
http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ
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On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
Electronics Forum | Mon Jan 15 15:40:18 EST 2007 | pyro747
Having problem with a 2X50 SCKT Strip PTH component(fine pitch) bridging on the wave. The PCB runs in wave pallets. Just wanting to know what successful findings have been done to eliminate bridging? Pallet angles? Copper or titanium inserts? Air kni
Electronics Forum | Tue Jan 16 20:44:07 EST 2007 | davef
Bridging Causes: Insufficient flux, Excessive pre-heat, High conveyor speed, Solder contamination Look here: * http://www.smtnet.com/library/files/upload/Reflow%20Wave%20Poster.pdf * http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Archi
Used SMT Equipment | Soldering - Wave
Electrovert Wave Soldering Machine Solder Pot Full of AIM 6367 Model Number: Electra Internal Foan Fluxer 21 inch Entrance Rail Extension Upgrade Dual Wave Rotary Speed Adjustable Contour Plus Nitrogen Rotary Chip Wav
Used SMT Equipment | Soldering - Wave
Senju Lead Free Wave SPF-300 Very Nice clean machine Dual Wave Solder No Nitrogen No Top Preheat Zones 355mm Max PCB width 3x Bottom Radiant Preheat Zones SPF-300
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Parts & Supplies | Pick and Place/Feeders
Universal AI part 255488000 mirror Other Universal AI parts in stock: 1 30952105 ACTUATOR 2 30952306 BLOCK 3 30952602 HOUSING 4 3095280
Parts & Supplies | Soldering - Wave
Removed from a working ERSA WHS 500F-400 Wave Solder machine FOB: Origin Contact AssuredTechnicalServiceLLC@Gmail.com KUHNKE DP BK Bridge 827551
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
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Handling the production line including two SWISS pick and place machines cobra and paraquda ,tucano printer reflow oven ,samsung loader and unloader.Hand on experience with 3D camera inspection system and solder paste height measuring instrument and
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