Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
Industry Directory | Manufacturer
Strive Technology is a leader in the manufacture and assembly of printed circuit boards in China. Our services including SMT Assembly PTH Assembly Component Procurement PCB Manufacture BGA Placement.
New Equipment | Wave Soldering
The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol
New Equipment | Wave Soldering
The most advanced high-performance wave soldering system designed for high-volume manufacturing. Electra's proven performance has provided the electronics assembly industry with world-class soldering results. The Electra system is designed with
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
Used SMT Equipment | Soldering - Wave
Windows: XP Version 2002, Service Pack2, KBM Premium Industrial Computer. Vectra Software: Version 3.05.0 Titanium Solder Pot w/ Custom 12” Titanium Ducts/Nozzles (Ultra-Fill & Rotary Chip Wave). Bar Solder Feeder Titanium Solder Pump
Used SMT Equipment | Soldering - Selective
ACE KISS 104 Selective Solder Model: KISS 104 Vintage: 2007 Voltage: 115/120 Two (2) pots - One leaded, one lead-free FEATURES: The KISS-104 is a fully configured In-Line SMEMA compatible Selective Soldering Machine ready to produce your produ
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2020-04-14 18:49:39.0
EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
Technical Library | 2008-08-28 22:50:11.0
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | Reynosa, Mexico | Engineering
This position is in our Reynosa manufacturing facility, which is across the border from McAllen, Texas. In this critical role, you will be responsible for PCBA, SMT, THT, Wave Solder and secondary operations which will include: =Ensure producti
Career Center | North Kingstown, Rhode Island USA | Maintenance
Based in our North Kingstown, RI facility, the temporary SMT Technician will help to develop and implement Printed Circuit Board assembly process & process work instructions for SMT & Through-hole. Major Tasks and Responsibilities: Monitor & M
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Career Center | Stouffville, Ontario Canada | Management
95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact Soldertip SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH There are many reasons for insufficient fill of a PTH (Plated Through Hole
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/odd-mounting-hole_topic496_post1507.html
. Maybe use 1 padstack and a fill for the other. Do you have a pic of it? Rick budnoel Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined: 16 Mar 2012 Status: Offline Points
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