Dealing in refurbished surface mount machines ,also dealing in jig and fixture for wave pallet .
Industry Directory | Manufacturer
ZGS Electronics Technology Sdn Bhd located at Penang, Malaysia with manufacturing plant mainly fabricating SMT Stencil, SMT pallet, Wave pallet, Magnetic pallet and Test Jig and fixtures.
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Synthetic Stone(the same quality of Durostone material): with black, gray, blue and red colors, etc. 2. Glass Fibre board: 3241 semiconduct
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
Electronics Forum | Wed Jan 12 12:48:23 EST 2005 | guest
Try scoring the underside of the pallet every inch or so, perpendicular to direction of travel
Electronics Forum | Wed Jan 12 19:48:41 EST 2005 | chad
Sue, What is the material your pallet is made of?? Are your thru pocket openings beveled??
Used SMT Equipment | Soldering - Selective
PRICE REDUCED TO $55,000. The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 18" x 20", color programming camera, offline programming and wave height measurement
Used SMT Equipment | Soldering - Wave
12" width conveyor mini, single wave pallet machine - comes with lead free solder
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2014-02-13 16:40:22.0
Kurtz Ersa North America will display the proven POWERFLOW e N2 at the IPC APEX EXPO. The compact full tunnel wave soldering system significantly reduces solder consumption as well as the unit cost attributable to the process.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler
Lewis & Clark | http://www.lewis-clark.com/product/mydata-asp-10-stick-pallet-l-014-1687/
Mydata/Mycronic ASP 10 Stick Pallet - Part# L-014-1687 - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
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