Industry Directory | Distributor
Representing Foreign Principals for their range of SMT / PCB Assembly equipments.
Industry Directory | Consultant / Service Provider / Manufacturer
WinTronics is a full service, ISO 9001:2000 certified, electronics and electro-mechanical contract manufacturer supporting customers in the commercial, industrial, automotive, Home Land Security, and military markets.
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our Wave Solder Fixtures increase productivity and eliminate defects in your pcb assembly process. This type of fixture supports the pcb on all four sides eliminating warpage that can cause solder skips and bridges or pcb flooding. They also elim
Electronics Forum | Thu Jul 08 04:26:27 EDT 2010 | bks
Hello, this is my first post in this forum, but sometimes I visit it to get some news. Now we have an issue and I need your advice. Few months ago we were awarded with a project that use PTH components. We solder these components on Wave soldering
Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Parts & Supplies | Pick and Place/Feeders
Hanwha HM520 HM8x2mm Feeder SMT Feeder Samsung Feeder Hanwha HM520 HM8x2mm Feeder Samsung pick and place machine Product description: Hanwha HM520 HM8x2mm Feeder INQUIRY Hanwha HM520 HM8x2mm Feeder Machine Details: For more info & pric
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/
& Place Feeder carts and trolleys Press Reflow Oven Rework Station Router Screen Printer Selective Solder Service Spare-Parts SPI- Solder Paste Inspection Systems Uncategorized Wave Solder Wire Bonder X-Ray ©2018 Lewis & Clark
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
