Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
Electronics Forum | Fri Mar 01 17:39:58 EST 2013 | davef
The LF wave solder solder alloy that marketing-types of other LF wave solder alloys compare themselves to is Nihon Superior SN100C
Electronics Forum | Thu Feb 28 16:17:14 EST 2013 | barryg
Hi All, after many years of talking about it we WILL be setting up a lead free line. What alloys and products would you recommend. We are seeting up a new wave machine here soon and could us some input.thanks
Used SMT Equipment | Soldering - Wave
Make: Vitronics Soltec Model: 6622 CC Vintage: 2005 Description: Wave Solder Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay
Used SMT Equipment | Soldering - Wave
1997 Soltec 6622C Wave Solder Machine Features: N2 Capable o Internal Fluxer o Cascade o Rotary & Chip Wave o 3 Zone Bottom Convection Preheaters
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Solder Wave Nozzle for a Vectra 450/F, Melonite Coated, Very little use, Very Good Condition, Was Used with SN100C, N2 compatible. Cost new over $3k. Thank you Ed AssuredTech@yahoo.com
Parts & Supplies | Soldering - Wave
Various replacement parts for EPK solder wave machines. Conveyor parts, solder pot parts, spray fluxer parts, control boards, electrical and mechanical. Inquire for details, Thank you, Ed AssuredTech@yahoo.com
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce product
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Near Orlando, Florida USA | Production
Technician responsible for operation & maintenance of Electrovert, Hollis & Westek wave soldering and aqueous pcb washers.
Career Center | South Plainfield, New Jersey USA | Management,Sales/Marketing
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation
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High Reliability Alloy Solder Paste For ENIG - PCBASupplies Login Create Account Contact View My Cart Menu × Categories Hand Soldering
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/zswz2-wave-solder-finger-226135?page=136&order=list_price+desc
Wave Solder Finger ZSWZ2 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Wave Solder Finger Public Pricelist Public Pricelist Wave
