Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2017-05-11 13:10:20.0
SEHO North America announced that it will hold its 2017 Technology Days in conjunction with guest presenters from ULT LLC (fume extraction technologies), DCT Czech (process cleaning technologies) and Stannol GmbH (soldering flux technologies). The event is scheduled to take place July 25-26, 2017 at SEHO’s North America new technology center in Erlanger, KY.
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In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal
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. Compacting during solder paste dispensing, can be observed in the dispense tip and all other sections of the flow path. Copper Mirror Test IPC–TM-650 2.3.32
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