Process Technology is a wet process heating and cooling equipment manufacturer offering electric immersion heaters, inline heaters, heat exchangers, and temperature and level controls.
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Solder Materials
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti
Electronics Forum | Sun Nov 25 20:47:44 EST 2001 | Yngwie
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Electronics Forum | Mon Nov 26 21:03:29 EST 2001 | davef
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Used SMT Equipment | Soldering - Wave
Vitronics Wave Soldering Machine [Completely Refurbished] Model: Delta 5 Vintage: 2013 Lead Free or Leaded Capabilities - Bare Pot 18" Max Conveyor Width Software Version: Delta 5 V4.12.0 Double Wave (Main Wave & Chip Wave) Motorized
Used SMT Equipment | Soldering - Wave
Vitronics Delta Wave 6622CC (2005) Lead free wave solder - Serial #: 0505763101 - Power: 60 kVA - Voltage: 3x400V - Cycles: 60 Hz - Mf
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2015-11-12 20:28:42.0
Nordson ASYMTEK introduces the Spectrum™ II Premier with the IntelliJet® jetting system for dispensing small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for advanced packaging applications. The IntelliJet system incorporates ASYMTEK's patent-pending 2-piece ReadiSet™ jet cartridge for fast and simple cleaning and maintenance.
Parts & Supplies | General Purpose Equipment
Part Number: 3051TG5A2B31JB4E8Q4Q8M6P1 Model: In-Line Pressure Transmitter Brand: Rosemount Ordering Information Model: 3051T(1) - In-Line Pressure Transmitter Pressure Type: G - Gage Pressure Range: 5 - -14.7 to 10000 psi (-1,01 to 689,47 bar
Parts & Supplies | General Purpose Test & Measurement
Part Number: 3051TG5A2B31JB4E8Q4Q8M6P1 Model: In-Line Pressure Transmitter Brand: Rosemount Ordering Information Model: 3051T(1) - In-Line Pressure Transmitter Pressure Type: G - Gage Pressure Range: 5 - -14.7 to 10000 psi (-1,01 to 689,47 bar) Tran
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
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. Lead-free wave soldering and lead-free reflow oven are necessary welding equipment for the production and welding of electronic products
